1050H Thickness Gauge
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1050H Thickness Gauge
■ One-size-fits-all Type
3-piece integrated gauge
- Thickness, Weight Measurement (Thickness, Weight, Density Simultaneous Analysis)
- + Integrate automation with contact thickness gauge
The whole process of cathode, anode, coating, and press used in the production of secondary batteries can be integrated into one measuring instrument.
3-piece integrated gauge
- Thickness, Weight Measurement (Thickness, Weight, Density Simultaneous Analysis)
- + Integrate automation with contact thickness gauge
The whole process of cathode, anode, coating, and press used in the production of secondary batteries can be integrated into one measuring instrument.
SPECIFICATIONS
Description | |
---|---|
Application | For secondary battery electrode plate manufacturing process, coating,Roll Press |
range | 0.03mm~3.6mm |
width | max. 1,000mm(C-Frame), max.2,000mm(O-frame) |
Pitch | 1mm (0.5-10mm) |
Spot size | 70µm/300µm |
Operating temperature | Up to 45℃(60℃) |
Option 1 | Thickness, Weight, Integral cathode Con+β-ray anode Con+X-ray (Simultaneous analysis of thickness, weight and density) |
Option 2 | Option 1 + Touch Type Automatic Measurement Gauge Resolution: 0.1µm |
PROGRAM SOFTWARE
MEK 프로그램의 특징
- • 사용자 친화적 구성 - 직관적 인터페이스
- • 언어 선택가능 한, 영, 중, 일
- • User HMI와 측정 데이터 통신(선택사양)
- • 사용자 요청에 맞춤 제작 가능
기본 화면
Description | |
---|---|
Run Environment | Labview 기반 자체 제작 소프트웨어 |
Data display | gsm (basis weight) / um (thickness) Spatial resolution : 1mm |
Data compatibility | Microsoft Excel, CSV |
Functions | Full automatic edge detection Full mapping of entire LOT (2D & 3D reconstruction) Real-time Profile & SPC (Staitstical-Process-Control) Trend chart FFT (Fast-Fourier-Transform) Analysis of MD Profile LOT Statistics & History 4 & 20 Scan Sigma |
Language | English, Korean, Chinese, Japanese (Hungarian translation available upon request) |
APC(Automatic Profile Control)
MEK 프로그램의 특징
- • 최적화된 두께 제어 알고리즘
- • 신속한 두께 제어
- • Auto Mapping: 센터볼트 기준
- • 매끈한 Mill Roll 외관
- • 수 Micron이내의 Control Gain 자동 조정
- • 다이볼트 온도 피드백 제어 (선택사양)
- • MD (Machine Direction) 제어 가능 (선택사양)
APC적용 후 프로파일 변화
Before
APC control begins after the target thickness is changed to 60㎛ to 30㎛
After 5min
Regulates Control Gain of auto-die, reducing variation in thickness
After 10min
Steadily analyzes and controls the thickness profiles
After 15min
Within 15min, produces the best result