1050 Thickness Gauge
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SPECIFICATIONS
Description | |
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Application | secondary battery electrode plates,Sheet, plate extrusion |
Range | 0.03mm~3.6mm/0.3~30mm |
Width | max. 1,000mm(C-Frame), 2,000mm(O-frame) |
Pitch | 1mm (0.5-10mm) |
Spot size | 70µm/300µm |
Scanning Speed | 150mm/sec (50~350mm/sec) |
Operating temperature | Up to 45℃(60℃) |
Repeatability | - Reproducibility during base fabric shutdown±0.02µm(10Scan) - Reproducibility during electrode fabric movement±0.2µm (May vary depending on product quality) - Base fabric reproducibility during movement±0.1µm - Sensor resolution ±0.0025µm/0.25µm |
PROGRAM SOFTWARE
MEK程序的特点
- • 用户友好型配置 - 直观界面
- • 可选择语言 - 韩语,英语,中文,日语
- • 用户HMI和测量数据通信(选配)
- • 可根据用户要求定制
基本界面
Description | |
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Run Environment | LabVIEW-based proprietary software |
Data display | gsm (basis weight) / um (thickness) Spatial resolution : 1mm |
Data compatibility | Microsoft Excel, CSV |
Functions | Full automatic edge detection Full mapping of entire LOT (2D & 3D reconstruction) Real-time Profile & SPC (Staitstical-Process-Control) Trend chart FFT (Fast-Fourier-Transform) Analysis of MD Profile LOT Statistics & History 4 & 20 Scan Sigma |
Language | English, Korean, Chinese, Japanese (Hungarian translation available upon request) |
APC(Automatic Profile Control)
MEK程序的特点
- • 优化的厚度控制算法
- • 快速厚度控制
- • Auto Mapping: 中心螺栓标准
- • 光滑的轧辊外观
- • 自动调整控制增益在数微米内
- • 模具螺栓温度反馈控制(可选)
- • MD (Machine Direction) 控制选项(可选)
应用APC后的配置变化
Before
APC control begins after the target thickness is changed to 60㎛ to 30㎛
After 5min
Regulates Control Gain of auto-die, reducing variation in thickness
After 10min
Steadily analyzes and controls the thickness profiles
After 15min
Within 15min, produces the best result